发明名称 TEST DEVICE AND METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a test device for accurately testing whether or not there is any foreign substance in a cover insulation layer and a method for manufacturing a wiring circuit board. <P>SOLUTION: In a test device 1 provided with a light source unit 2 for emitting incidence light 31 incident to a cover insulation layer and a camera unit 3 for receiving reflecting light 32 in which the incidence light 31 is reflected on the surface of the cover insulation layer, the light source unit 2 is provided with a circular first light emitting part 6 for emitting the incidence light 31 so that an angle between itself and the surface of a base insulation layer is 25&deg; or less, and a circular second light emitting part 7 for emitting the incidence light 31 so that an angle between itself and the surface of the base insulation layer ranges from 35 to 65&deg;. The test device 1 is used to test whether or not there is any foreign substance in the cover insulation layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012063245(A) 申请公布日期 2012.03.29
申请号 JP20100207563 申请日期 2010.09.16
申请人 NITTO DENKO CORP 发明人 TOYODA YOSHIHIRO
分类号 G01N21/956;H05K3/00 主分类号 G01N21/956
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