发明名称 POLISHING LIQUID COMPOSITION
摘要 A polishing liquid composition that makes it possible to provide a polished substrate surface on which scratches and/or waviness are reduced, without impairing productivity, is provided, and further, a method for manufacturing and polishing a substrate using this polishing liquid composition is provided. The polishing liquid composition contains an abrasive, a water-soluble polymer, and water, wherein the water-soluble polymer has a sulfonic acid group, and has an aromatic ring in each of a main chain and a side chain. The method for manufacturing a substrate, and the method for polishing a substrate, include performing polishing by supplying the above-described polishing liquid composition to a surface to be polished of a substrate to be polished, bringing a polishing pad into contact with the surface to be polished, and moving the polishing pad and/or the substrate to be polished.
申请公布号 US2012077422(A1) 申请公布日期 2012.03.29
申请号 US201113314397 申请日期 2011.12.08
申请人 YOSHINO TAIKI 发明人 YOSHINO TAIKI
分类号 B24B1/00;B82Y30/00;C09K13/00;C09K13/06 主分类号 B24B1/00
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