MAINTAINABLE SUBSTRATE CARRIER FOR ELECTROPLATING

摘要

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body (102 and 202) on which the substrates are placed and conductive lines (128) embedded within the carrier body. A plurality of conductive clip attachment parts (130) are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips (802 or 900 or 1000) are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.