发明名称 |
Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier |
摘要 |
A manufacturing method of forming an electrical circuit on a non-conductive carrier comprises following steps. After providing an electrically non-conductive carrier, catalysts are dispersed on or in the electrically non-conductive carrier. A predetermined track structure is formed on the electrically non-conductive carrier to expose the catalysts on the surface of the predetermined track structure. The surface of the predetermined track structure containing the catalysts is metalized to form a conductor track. |
申请公布号 |
US2012074094(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US201113206047 |
申请日期 |
2011.08.09 |
申请人 |
CHIANG CHENG-FENG;CHIANG JUNG-CHUAN;FU WEI-CHENG;KUANG HONG PRECISION CO., LTD. |
发明人 |
CHIANG CHENG-FENG;CHIANG JUNG-CHUAN;FU WEI-CHENG |
分类号 |
H05K3/10;B82Y99/00;H05K3/22 |
主分类号 |
H05K3/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|