发明名称 Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier
摘要 A manufacturing method of forming an electrical circuit on a non-conductive carrier comprises following steps. After providing an electrically non-conductive carrier, catalysts are dispersed on or in the electrically non-conductive carrier. A predetermined track structure is formed on the electrically non-conductive carrier to expose the catalysts on the surface of the predetermined track structure. The surface of the predetermined track structure containing the catalysts is metalized to form a conductor track.
申请公布号 US2012074094(A1) 申请公布日期 2012.03.29
申请号 US201113206047 申请日期 2011.08.09
申请人 CHIANG CHENG-FENG;CHIANG JUNG-CHUAN;FU WEI-CHENG;KUANG HONG PRECISION CO., LTD. 发明人 CHIANG CHENG-FENG;CHIANG JUNG-CHUAN;FU WEI-CHENG
分类号 H05K3/10;B82Y99/00;H05K3/22 主分类号 H05K3/10
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