| 摘要 |
<p>This invention relates to stencil printing equipment production and stencil printing technology. Stencil of solid metal for application of solder paste or glue in the field of stencil printing technology. For better quality and more solid tighteningon the frame the perforation in the peripheral areas is carried out as rectangular shaped holes. When it is linked towards the center of the stencil the perforation holes part is rounded oval shape, and in the corners there are rounded cutouts.</p> |
