| 发明名称 |
FILM FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film with a dicing sheet excellent in reliability and capable of easily performing cover film leader leading-out (leader leading-out) while maintaining a transfer mark suppression function when a film for a semiconductor device comprising a cover film on which an adhesive film with a dicing sheet having the adhesive film laminated on a dicing film is laminated at predetermined intervals is rewound in a roll form. <P>SOLUTION: A film for a semiconductor device comprises a cover film on which an adhesive film with a dicing sheet having the adhesive film laminated on a dicing film is laminated at predetermined intervals. In this film, a ratio Ea/Eb of a tensile storage elastic modulus Ea of the dicing film at 23°C to a tensile storage elastic modulus Eb of the cover film at 23°C is within 0.001 to 100. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012059768(A) |
申请公布日期 |
2012.03.22 |
| 申请号 |
JP20100199027 |
申请日期 |
2010.09.06 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
AMANO YASUHIRO;KIMURA TAKEHIRO |
| 分类号 |
H01L21/301;C09J7/02;C09J201/00;H01L21/52 |
主分类号 |
H01L21/301 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
