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发明名称
PLATING SOLUTIONS FOR ELECTROLESS DEPOSITION OF COPPER
摘要
申请公布号
EP2036098(A4)
申请公布日期
2012.03.21
申请号
EP20070784146
申请日期
2007.05.25
申请人
LAM RESEARCH CORPORATION
发明人
DORDI, YEZDI;THIE, WILLIAM;VASKELIS, ALGIRDAS;NORKUS, EUGENIJUS;JACIAUSKIENE, JANE;JAGMINIENE, ALDONA
分类号
H01B13/00;C23C18/40;C23C18/50
主分类号
H01B13/00
代理机构
代理人
主权项
地址
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