发明名称 |
ELEKTRONISCHE BAUEINHEIT UND VERFAHREN ZU DEREN HERSTELLUNG |
摘要 |
An electronic assembly has at least one conductor substrate carrying components, which conductor substrate is surrounded by a mechanical protection. The conductor substrate is encased using a molding compound as a mechanical protection and is contacted by at least one intrinsically stiff, spring-elastic electrical connection conductor, the connection conductor being embedded in the molding compound, at least in sections. |
申请公布号 |
AT546033(T) |
申请公布日期 |
2012.03.15 |
申请号 |
AT20090779770T |
申请日期 |
2009.06.16 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
ROETHLINGSHOEFER, WALTER;GOEBEL, ULRICH |
分类号 |
H05K3/28;H01L23/433;H01L23/495;H05K1/14;H05K3/36 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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