PLATING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A substrate plating method and a circuit board manufacturing method using the same are provided to minimize plating deviation caused by the effect of a dummy area in a circuit board arranged on the perimeter of a panel substrate. CONSTITUTION: A circuit board manufacturing method comprise the steps of: preparing a panel substrate(5) divided into a circuit board area and a dummy area, calculating the area ratio of a circuit pattern in the circuit board area, determining the ratio of a plated area in the dummy area in consideration of a plating area ratio of the circuit board area, setting a plated part in the circuit board are and the dummy area, and electroplating the panel substrate to form the circuit pattern.