SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A semiconductor package substrate and a manufacturing method thereof are provided to improve an adhesive force with a protective layer by additionally forming a metal layer on a protective layer including polyimide. CONSTITUTION: A base substrate includes a connection pad(103). Wirings(102,104) and a soldering pad(105) are placed in the base substrate. A protective layer(106) is formed to protect an outermost layer circuit. The protective layer includes a first open part including polyimide. A post bump(115) is formed in the first open part of the protective layer.