| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting device capable of suction holding even a package substrate with warpage, and cutting it. <P>SOLUTION: The cutting device comprises a holding table 2 for holding a package substrate 6 with warpage having a device area 61, in which a device is formed, and an outer peripheral end material area 62 surrounding the device area 61; and cutting means for cutting the package substrate 6. The holding table 2 comprises a plurality of suction holes 52 formed in each area blocked by a clearance groove 51 for a cutting blade, a negative pressure transmission part for transmitting a negative pressure for sucking the package substrate 6 to a holding face, and a negative pressure leakage prevention wall 53 including an elastic member formed at a position corresponding to the outer peripheral end material area 62 of the holding face 50. The negative pressure leakage prevention wall 53 including the elastic member is provided at a position corresponding to the outer peripheral end material area 62 of the package substrate 6, and therefore, even the package substrate 6 with warpage can be suction held, and can be reliably cut. <P>COPYRIGHT: (C)2012,JPO&INPIT |
