| 摘要 |
<P>PROBLEM TO BE SOLVED: To nondestructively diagnose deterioration of an electronic component including a solder joint part. <P>SOLUTION: A data image of thermal distribution of the electronic component including a solder joint part is measured with time while heating the electronic component. Fractal analysis based on N(R)×RD=C (1) (where N(R) is the number of cubes required for covering, R is a length of one side of the cube, D is a fractal dimension, and C is a constant (volume of an object solid)) is performed in accordance with the data image of thermal distribution to obtain a fractal dimension. Subsequently, aging of the fractal dimension is evaluated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
