发明名称 |
SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME |
摘要 |
Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer. |
申请公布号 |
EP2424337(A1) |
申请公布日期 |
2012.02.29 |
申请号 |
EP20100766975 |
申请日期 |
2010.04.13 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OKA, YOSHIO;KASUGA, TAKASHI;OKADA, ISSEI;MIKAGE, KATSUNARI;UENISHI, NAOTA;OKUDA, YASUHIRO |
分类号 |
H05K3/24;H05K3/18 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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