| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which energization of programming can be minimized, and drop in yield of logic circuit due to failure of fuse via cutting can be improved. <P>SOLUTION: A via fuse cutting electric fuse 3 is formed at such a part where it is uncertain whether cutting of a fuse via is required or not. A via cut electric fuse 5 where the fuse via is omitted is formed at such a part where it is certain that cutting of a fuse via is required. <P>COPYRIGHT: (C)2012,JPO&INPIT |
