发明名称 ELECTRONIC CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic circuit board including a through electrode held in the prescribed position of a substrate while maintaining high position accuracy and a method of manufacturing the electronic circuit board. <P>SOLUTION: An electronic circuit board 1 includes a substrate 2 made of insulation material, one or multiple through electrodes 3, made of a conductive material and disposed by penetrating the substrate 2, and recessed parts 4 formed at one end, exposed from the substrate 2, of the through electrodes 3. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012039072(A) 申请公布日期 2012.02.23
申请号 JP20110048199 申请日期 2011.03.04
申请人 SEIKO INSTRUMENTS INC 发明人
分类号 H01L23/12;H01L23/04;H03B5/32;H03H3/02;H03H9/02 主分类号 H01L23/12
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