| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent mounting failure of a semiconductor device. <P>SOLUTION: A BGA (a semiconductor device) 1 comprises: a semiconductor chip 2 having a first surface 2a and electrode pads (bonding pads) 2c formed on the first surface 2a; and solder balls 10 electrically connected to the electrode pads 2c of the semiconductor chip 2. Each solder ball 10 has a plurality of core balls 11 and a solder material 12 covering the plurality of the core balls 11. For this reason, when the BGA 1 is mounted on a mounting board, the core balls 11 can prevent the solder balls 10 from deforming and being an obstruction for crashing, thereby preventing the mounting failure of the BGA 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
