INDUCTION HEATING APPARATUS AND INDUCTION HEATING METHOD

摘要

[Objective] To provide a semiconductor-substrate heating apparatus, wherein, even when horizontal magnetic fluxes are given to susceptors, and a plurality of induction heating coils are arranged in the vertical direction, influence of mutual induction between the induction heating coils can be inhibited, and a favorable heating control can be enabled. [Solution] Provided is a heating apparatus (10) that indirectly heats wafers (54) placed on susceptors (52) arranged in horizontal orientation, and that comprises: induction heating coils arranged at the outer circumference side of the susceptors (52), and that form AC magnetic fluxes in a direction parallel to the faces of the susceptors (52) upon which the wafers (54) are to be placed. The heating apparatus (10) is characterized in that the induction heating coils are composed of at least one main heating coil (30) and subordinate heating coils (32, 34) that couple electromagnetically with the main heating coil (30), and the main heating coil (30) is provided with inverse coupling coils (36, 38) that inversely couples electromagnetically with the subordinate heating coils (32, 34). The heating apparatus (10) is also characterized in being provided with a zone controlling means (22) for synchronizing the frequency and current waveform of the currents to be fed to the main heating coil (30) and the subordinate heating coils (32, 34), which are arranged to be adjacent to each other, and controlling the ratio of the powers to be fed thereto, individually.