| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermoplastic polyhydroxy polyether resin that has low elasticity and low stress at normal temperature, a glass transition point higher than 90°C and a high retention of elasticity at a high-temperature and an epoxy resin composition. SOLUTION: The thermoplastic polyhydroxy polyether resin comprises ≥8 mol% of a fluorene backbone as a constituent component and an organosiloxane as a constituent component, is represented by formula (I) and has 10,000-200,000 molecular weight. The heat-resistant insulating film is obtained by forming the thermoplastic polyhydroxy polyether resin into a film. COPYRIGHT: (C)2007,JPO&INPIT |
