发明名称 |
Apparatus for electrically coupling a semiconductor package to a printed circuit board |
摘要 |
An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate. |
申请公布号 |
US8116097(B2) |
申请公布日期 |
2012.02.14 |
申请号 |
US20070934340 |
申请日期 |
2007.11.02 |
申请人 |
LOVE DAVID G.;SEN BIDYUT K.;ORACLE AMERICA, INC. |
发明人 |
LOVE DAVID G.;SEN BIDYUT K. |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|