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发明名称
热管与热传基座之结合方法及其结构
摘要
一种热管与热传基座之结合方法及其结构,其主要系进一步以一导热块压制于热管上,再令热传基座将热管与导热块一同包覆于其中。如此除了可令热管稳固结合于热传基座上外,更可使热管与热传基座作面与面之接触,以藉由所增加的接触面积与接触效果,来达到热管与热传基座之间良好的热传效果。
申请公布号
TWI357968
申请公布日期
2012.02.11
申请号
TW095134186
申请日期
2006.09.15
申请人
鈤新科技股份有限公司 新北市五股区五权路60号;珍通科技股份有限公司 新北市五股区五权五路13号
发明人
林国仁;许建财;刘文荣
分类号
F28F9/26
主分类号
F28F9/26
代理机构
代理人
谢佩玲 台北市大安区罗斯福路2段107号12楼
主权项
地址
新北市五股区五权五路13号
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