| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an element housing package that can improve transmission performance of a high-frequency signal, and to provide a semiconductor device having the same. <P>SOLUTION: An element housing package has: a base body 1 having a mounting part 1a for a semiconductor element 6; a frame body 2 having a shelf part 2b therein; a coaxial connector 4 having an outer peripheral conductor 4a, a central conductor 4c, and an insulator 4b; a circuit board 3 in which a line conductor 3a connected to the central conductor 4c and a first grounded conductor layer 3b are provided on an upper surface, and a second grounded conductor layer 3c is provided on a lower surface; and a bonding material 7 for bonding the circuit board 3 with the shelf part 2b. The circuit board 3 has a notch 3e vertically notched whose inner surface is provided with a conductor layer 3d electrically connected to the first grounded conductor layer 3b and the second grounded conductor layer 3c. When the notch 3e is viewed from a direction orthogonal to the central conductor 4c laterally, a part of the central conductor 4c is located immediately above the notch 3e. <P>COPYRIGHT: (C)2012,JPO&INPIT |
