| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition, improved in softening temperature, for bonding a wafer. <P>SOLUTION: The adhesive composition for bonding the wafer comprises: a resin having adhesiveness; and a filler. Moreover, an adhesive film includes an adhesive layer containing the adhesive composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
