发明名称 METHOD OF COMPRESSION MOLDING FOR ELECTRONIC PART AND APPARATUS THEREFOR
摘要 First, a given amount of granular resin (6) is fed into a resin accommodation space (22) of plate (21). Secondly, the plate (21) is covered with a mold release film (11) so as to spread over the resin accommodation space (22). Thirdly, the resin accommodation space (22) is set to a given degree of vacuum. Fourthly, the plate (21) covered with the mold release film (11) is turned upside down. Finally, the plate turned upside down is moved into a cavity (5), so that the surface of the cavity (5) is covered with the mold release film (11). In this situation, the granular resin (6) is caused to fall from the resin accommodation space (22) into the cavity (5) covered with the mold release film (11).
申请公布号 KR101107843(B1) 申请公布日期 2012.02.09
申请号 KR20097014160 申请日期 2008.03.06
申请人 TOWA CORP 发明人 AMAKAWA TSUYOSHI;TAKASE SHINJI;ONISHI YOHEI;URAGAMI HIROSHI;TAKADA NAOKI;OTSUKI OSAMU;ODA MAMORU
分类号 B29C43/18;B29C43/32;B29C43/34;B29C43/58 主分类号 B29C43/18
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