| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition having excellent injection property to a narrow gap in a flip-chip type semiconductor device and allowing application in a narrow application space. <P>SOLUTION: The liquid sealing resin composition used for sealing a gap between a semiconductor chip and a substrate or between semiconductor chips in the flip-chip type semiconductor device comprises: (A) a liquid epoxy resin; (B) a curing agent; and (C) an inorganic filler. In the liquid sealing resin composition: viscosity at an injection temperature is 0.1 Pa s or lower; and a contact angle (θ) to the semiconductor chip surface and the substrate surface at the injection temperature and a curing temperature is 15 degrees or more. <P>COPYRIGHT: (C)2012,JPO&INPIT |
