| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe device which can prevent the gap between probes from being largely deviated from the gap between electrodes on a semiconductor wafer by making the temperature of a probe card follow the temperature changes on the semiconductor wafer. <P>SOLUTION: A probe device comprises: a wafer chuck 21 which holds a semiconductor wafer 11; a probe card holder 22 which holds a probe card 12; a chuck horizontal driver 24 which moves the wafer chuck 21 from an inspection position A1, immediately below the probe card 12, to a retracted position A2; a halogen lamp 25 which generates radiation light 2 for heating the probe card 12; and a light source unit horizontal driver 28 which moves the halogen lamp 25 to an irradiation position facing the underside of the probe card 12 when the wafer chuck 21 is retracted, and moves the halogen lamp 25 to a retracted position when the semiconductor wafer 11 is inspected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
