| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heating source device which inexpensively and effectively cools an element substrate on which semiconductor elements such as an LED element emitting heating light are mounted. <P>SOLUTION: Heating source devices 22A and 22B for heating a workpiece W includes element substrates 52 and 58 having multiple semiconductor elements emitting heating light mounted on one of its surfaces; decompression cooling chambers 54 and 60 which are provided on the other surface of the element substrates and decompressed; and refrigerant supply mechanisms 56 and 62 for supplying the refrigerant to the interior of the decompression cooling chambers. Thereby, each element substrate, on which the semiconductor elements such as the LED elements emitting heating light are mounted, is cooled inexpensively and effectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
