SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

摘要

Disclosed is a substrate processing device that, without being equipped with a cleaning chamber for cleaning, can efficiently and evenly clean a substrate surface in a short amount of time, and can increase substrate processing throughput. The substrate processing device is provided with: a receiving chamber for receiving a substrate; a film formation chamber that executes film-formation processing on the substrate; and a conveyance chamber having a substrate conveyance mechanism that conveys the substrate between the aforementioned receiving chamber and the aforementioned film formation chamber. The aforementioned receiving chamber and the aforementioned conveyance chamber are connected in an adjacent state, and the outside of either the aforementioned receiving chamber or the aforementioned conveyance chamber is provided with: a light radiating mechanism that radiates light on the conveyance pathway of the substrate; and a control unit that controls the amount and intensity of light radiated from the aforementioned light radiating mechanism. A transmission window that allows the passage of the light radiated from the aforementioned light radiating mechanism is provided to the one of the aforementioned receiving chamber or the aforementioned conveyance chamber to which the aforementioned light radiating mechanism is provided. The light radiated from the aforementioned light radiating mechanism to the substrate is radiated while moving the light relatively with respect to the substrate.