| 发明名称 |
FRONT-END PROCESSING OF NICKEL PLATED BOND PADS |
| 摘要 |
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication. |
| 申请公布号 |
US2012025379(A1) |
申请公布日期 |
2012.02.02 |
| 申请号 |
US201113253512 |
申请日期 |
2011.10.05 |
| 申请人 |
MOORE JOHN;BROOKS JOSEPH F. |
发明人 |
MOORE JOHN;BROOKS JOSEPH F. |
| 分类号 |
H01L23/48;H01L21/768;H01L45/00 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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