| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a failure analysis method of a semiconductor device which can accurately extract the manufacturing condition that is possibly the cause of a failure. <P>SOLUTION: A computer reads in the percent defective data for every inspection unit of wafers and the information about manufacturing condition of a wafer, and performs statistical tests of the percent defective data for the manufacturing condition. The computer collects and outputs the results of statistical tests for every information of manufacturing condition. The results of statistical tests are output as map data corresponding to the position in the plane of a wafer, for example. <P>COPYRIGHT: (C)2012,JPO&INPIT |
