SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING STEP OF REMOVING PAD ELECTRODE FOR INSPECTION

摘要

First of all, a first interlayer insulating film (101) is formed on a semiconductor substrate (100) on which an element to be measured is formed. After that, a contact plug (206) that is electrically connected to the element to be measured and a first wiring line (102) that is electrically connected to the contact plug (206) are formed in the first interlayer insulating film (101). Next, a pad electrode for inspection (104A) that is composed of an organic conductive film is formed on the first interlayer insulating film (101) so as to be connected to the first wiring line (102). Following that, the electrical characteristics of the element to be measured are measured, while keeping a probe needle (107) in contact with the pad electrode for inspection (104A). After that, the pad electrode for inspection (104A) is removed.