| 发明名称 |
PRE-SOLDER METHOD AND REWORK METHOD FOR MULTI-ROW QFN CHIP |
| 摘要 |
A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged chip is heated, such that the solder paste on the at least one pad of the multi-row QFN packaged chip becomes solid solder before the multi-row QFN packaged chip is mounted on a substrate.
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| 申请公布号 |
US2012018498(A1) |
申请公布日期 |
2012.01.26 |
| 申请号 |
US20100997032 |
申请日期 |
2010.07.20 |
| 申请人 |
ZHONG XIN;CHIANG CHIH-MING;HSU CHIH-TAI;MEDIATEK (SHENZHEN) INC. |
发明人 |
ZHONG XIN;CHIANG CHIH-MING;HSU CHIH-TAI |
| 分类号 |
B23K31/02;B23K1/20 |
主分类号 |
B23K31/02 |
| 代理机构 |
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