| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for removing an organic substance capable of removing even such an organic substance on the surface of a photoresist etc. which is highly deteriorated and hardened by the damage during the manufacturing process thereof at a high peeling speed and having no environmental problem. SOLUTION: The method for removing the organic substance adhered onto the surface of a substance comprises the steps of (1) irradiating the organic substance with a laser beam and (2) removing the organic substance on the substrate by bringing a treatment solution into contact with the substrate simultaneously with or after the step (1). The apparatus for removing the organic substance adhered onto the surface of the substance comprises (a) a means for supporting the substrate, (b) a means for bringing the treatment solution into contact with the substrate, and (c) a means for irradiating the organic substance with the laser beam. COPYRIGHT: (C)2006,JPO&NCIPI |
