Optionally bonding either two sides or more sides of integrated circuits

摘要

Methods and systems for forming a variety of integrated circuits, having quite different interfaces and packages, from a single manufactured die. Preferably the die has bond pads for at least a first mode of operation positioned along only two of its four sides, and these bond pads are sufficient to construct a multi-chip module in which the die is functional in the first mode of operation. Many of the pads on these two sides are duplicated on third and/or fourth sides, except that power management circuitry prevents wasteful capacitive current onto whichever of the duplicated pads is not connected out. Optionally the third and/or fourth sides can be used for connections needed for a mode which is not available with two sides only.