METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURED BY USING THE SAME, METHOD FOR MANUFACTURING ELECTRIC AND ELECTRONIC COMPONENT, AND ELECTRIC AND ELECTRONIC COMPONENT MANUFACTURED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which has superior productivity without a flax washing process, and can reduce warpage caused by grinding a back surface of a semiconductor wafer, and the semiconductor device manufactured by using the same.

SOLUTION: A method for manufacturing a semiconductor device comprises a first step for forming a resin composition layer with a flux function and a back grind tape on a circuit surface of a semiconductor wafer where a first connecting electrode is provided thereon, in this order; a second step for grinding an opposing surface to the circuit surface of the semiconductor wafer; a third step for laminating a dicing tape on the opposing surface to the circuit surface of the semiconductor wafer; a forth step for peeling off the back grind tape; a fifth step for dividing the resin composition layer with the flux function and the semiconductor wafer into pieces to obtain a semiconductor chip having the resin composition layer with the flux function; and additional two steps.

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