发明名称 ELECTRONIC DEVICE AND IMAGE FORMING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To prevent breakage of a semiconductor by using a simple configuration. <P>SOLUTION: An electronic device 100 comprises a substrate 101, a substrate 102, and a V3 power supply harness 117. The substrate 101 comprises: a DC/DC converter 14 for outputting a converted power that is obtained by converting a power supplied from a PSU 103; and a semiconductor 13 for outputting a control signal, which is used to control output of the supplied power, to the substrate 102. The substrate 102 comprises: a semiconductor 12 operating by the supplied power and the converted power; and a connector 123 for outputting a control signal to a PSU 103. The V3 power supply harness 117 includes: a signal line for the control signal; and a power line for supplying the converted power from the substrate 101 to the substrate 102. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012008943(A) 申请公布日期 2012.01.12
申请号 JP20100146446 申请日期 2010.06.28
申请人 RICOH CO LTD 发明人 SHIRAI TAKAAKI
分类号 G06F1/26;B41J29/00;B41J29/46;G03G15/00;G03G21/00;H04N1/00 主分类号 G06F1/26
代理机构 代理人
主权项
地址
您可能感兴趣的专利