发明名称 HYBRID SUBSTRATE AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate that is suitable for manufacturing a build-up substrate. <P>SOLUTION: A hybrid substrate according to the present invention comprises a ceramic substrate aggregate comprised of a plurality of ceramic substrates; insulation resin layers disposed on both surfaces of a ceramic substrate aggregate in an opposed manner, and formed at least of reinforcement material and a resin, and a metal layer disposed on the insulation resin layer. In a hybrid substrate according to the present invention, a plurality of ceramic substrates are tiled along a same plane between insulation resin layers disposed in an opposed manner. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012009850(A) 申请公布日期 2012.01.12
申请号 JP20110116075 申请日期 2011.05.24
申请人 PANASONIC CORP 发明人 TOYOOKA SHUN;OKADA HIROSHI;SEGAWA SHIGETOSHI;NAKATANI SEIICHI
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
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