发明名称 |
HEAT RELEASE UNIT FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS USING SAME |
摘要 |
<p>The disclosed heat release unit (7) is of an electronic apparatus (1) and is provided with a partition plate (9) and a heat exchange body (10). The partition plate has a first air hole (12) and a second air hole (13). On the outer side, the heat exchange body is configured from connecting the first air hole and the second air hole by means of a plurality of spaced parallel ducts (14). On the outer side, a first blower (11) is provided that blows air from the inner side from the first air hole through the ducts to the second air hole, and a second blower (17) is provided that blows air on the outer side to the surface of the ducts.</p> |
申请公布号 |
WO2012004949(A1) |
申请公布日期 |
2012.01.12 |
申请号 |
WO2011JP03699 |
申请日期 |
2011.06.29 |
申请人 |
PANASONIC CORPORATION;MIYAKE, SHUNJI;MURAYAMA, TAKUYA;WAKAMATSU, TOMONORI;SUGIYAMA, MAKOTO |
发明人 |
MIYAKE, SHUNJI;MURAYAMA, TAKUYA;WAKAMATSU, TOMONORI;SUGIYAMA, MAKOTO |
分类号 |
G09F9/00;H04N5/64;H05K7/20 |
主分类号 |
G09F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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