发明名称 HEAT RELEASE UNIT FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS USING SAME
摘要 <p>The disclosed heat release unit (7) is of an electronic apparatus (1) and is provided with a partition plate (9) and a heat exchange body (10). The partition plate has a first air hole (12) and a second air hole (13). On the outer side, the heat exchange body is configured from connecting the first air hole and the second air hole by means of a plurality of spaced parallel ducts (14). On the outer side, a first blower (11) is provided that blows air from the inner side from the first air hole through the ducts to the second air hole, and a second blower (17) is provided that blows air on the outer side to the surface of the ducts.</p>
申请公布号 WO2012004949(A1) 申请公布日期 2012.01.12
申请号 WO2011JP03699 申请日期 2011.06.29
申请人 PANASONIC CORPORATION;MIYAKE, SHUNJI;MURAYAMA, TAKUYA;WAKAMATSU, TOMONORI;SUGIYAMA, MAKOTO 发明人 MIYAKE, SHUNJI;MURAYAMA, TAKUYA;WAKAMATSU, TOMONORI;SUGIYAMA, MAKOTO
分类号 G09F9/00;H04N5/64;H05K7/20 主分类号 G09F9/00
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