Laser diodes with cooling system

摘要

The subject-matter of the invention is semiconductor laser diodes with a cooling system. The device comprises a laser arrangement with a cooling system in layer design, in which one layer is a substrate which contains one or more laser diodes, and in which at least one layer is structured such that closed channels result from superposition of the layers, through which channels a coolant flows and in which the substrate is in direct contact with the coolant. A preferred embodiment consists in integrating the laser diodes on a chip and structuring this chip on the back with microchannels. The advantage of the component according to the invention consists in that, by direct contact of the coolant with the substrate or with the laser diode chip, the thermal resistance of the active laser region with respect to the coolant is greatly reduced. By integrating the substrate or the laser diode chip in the microchannel heat sinks, the number of layers required can be decreased and the dimension of the component can be reduced. The cooling channels of the component are, depending on the material composition, produced using etching, laser processing, punching or electrolytic technique (electroplating).