发明名称 |
Chip package and manufacturing method thereof |
摘要 |
A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
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申请公布号 |
US8093690(B2) |
申请公布日期 |
2012.01.10 |
申请号 |
US20090414996 |
申请日期 |
2009.03.31 |
申请人 |
KO DONGKYUN;LEE JUNG;AN JAESUN;ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
KO DONGKYUN;LEE JUNG;AN JAESUN |
分类号 |
H01L23/552;H01L21/78 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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