发明名称 |
Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same |
摘要 |
A semiconductor package and methods for manufacturing the same are provided. The semiconductor package includes a substrate, first and second semiconductor chips stacked on the substrate. An interposer is disposed between the first and second semiconductor chips. The interposer has a non-planar top surface.
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申请公布号 |
US8093726(B2) |
申请公布日期 |
2012.01.10 |
申请号 |
US20080286656 |
申请日期 |
2008.10.01 |
申请人 |
PARK SUNG-YONG;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK SUNG-YONG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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