| 摘要 |
<P>PROBLEM TO BE SOLVED: To completely fill a gap between a board surface and an electronic component to be mounted such as a chip capacitor with sealing resin, thereby contributing to the improvement of insulation reliability. <P>SOLUTION: A wiring board 10 has a structure in which a plurality of wiring layers are laminated with insulating layers interposed therebetween and interconnected through a via-hole formed on each of the insulating layers. A plurality of pads 12 for mounting electronic components are formed on an insulating layer 13, which is the outermost layer on the surface mounted with a chip, so as to be exposed on the surface of the insulating layer 13. A recess DP is formed in a portion of the insulating layer 13 which corresponds to a mounting region for an electronic component 31. In the insulating layer 13, the recess DP is formed in a region sandwiched by the pads 12 to which respective electrode terminals 32 of the electronic component 31 mounted on the board are connected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
