发明名称 THERMAL INTERFACE MATERIAL ASSEMBLIES, AND RELATED METHODS
摘要 A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted.
申请公布号 US2011310562(A1) 申请公布日期 2011.12.22
申请号 US20100816735 申请日期 2010.06.16
申请人 STRADER JASON L.;HILL RICHARD F.;LAIRD TECHNOLOGIES, INC. 发明人 STRADER JASON L.;HILL RICHARD F.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利