Package And Packaging Method For Improving Reliability Of Solder Joint,申请号KR20050128613-传众专利搜索

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发明名称	Package And Packaging Method For Improving Reliability Of Solder Joint
摘要
申请公布号	KR101096437(B1)	申请公布日期	2011.12.20
申请号	KR20050128613	申请日期	2005.12.23
申请人		发明人
分类号	H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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