发明名称 CIRCUIT MODULE
摘要 In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.
申请公布号 US2011304993(A1) 申请公布日期 2011.12.15
申请号 US201113156496 申请日期 2011.06.09
申请人 TAKEMURA TADAJI;MURATA MANUFACTURING CO., LTD. 发明人 TAKEMURA TADAJI
分类号 H05K1/02 主分类号 H05K1/02
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