WAFER BACKSIDE COATING CONTAINING REACTIVE SULFUR COMPOUND,申请号WO2011US39061-传众专利搜索

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发明名称	WAFER BACKSIDE COATING CONTAINING REACTIVE SULFUR COMPOUND
摘要	<p>A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.</p>
申请公布号	WO2011156225(A2)	申请公布日期	2011.12.15
申请号	WO2011US39061	申请日期	2011.06.03
申请人	HENKEL CORPORATION;HAJELA, SHARAD;KONG, SHENGQIAN;GASA, JEFFREY;LEON, JEFFREY;PHAN, DUNG, NGHI	发明人	HAJELA, SHARAD;KONG, SHENGQIAN;GASA, JEFFREY;LEON, JEFFREY;PHAN, DUNG, NGHI
分类号	C09J163/00;C09J11/00;C09J133/04	主分类号	C09J163/00
代理机构		代理人
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