| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid processing apparatus and a liquid processing method that can reduce reattachment of mist on a substrate by suppressing a back flow of an emission flow even when the number of revolutions of the substrate is increased and the emission in a processing cup is discharged in a low displacement volume. <P>SOLUTION: A resist coating apparatus for performing a spin coating comprises: a bottom side guide part 45 extending toward an outside lower side from a position adjacent to a peripheral edge portion of a back surface of a wafer W; a top side guide part 70 whose upper end surface is positioned approximately at the same level as a top surface of the wafer W and forming, between itself and the bottom side guide 45, a bottom side circular channel 79 for guiding an air flow in a downward direction; an outside cup 60 forming an annular space 78 between itself and the top side guide part 70; and a protrusion part 100 protruded from a bottom surface of the outside cup 60 toward a top surface of the top side guide part 70 so as to narrow the annular space 78 in the middle thereof, and circularly formed in a circumferential direction. Accordingly, an air flow passing through the annular space 78 and an air flow passing through the bottom circular channel 79 are combined. <P>COPYRIGHT: (C)2012,JPO&INPIT |
