CU-CO-SI-BASED ALLOY SHEET, AND PROCESS FOR PRODUCTION THEREOF

摘要

Disclosed is a Cu-Co-Si-based alloy sheet which can be used suitably for various electronic components and can be plated satisfactorily and homogeneously. Specifically disclosed is a copper alloy sheet for an electronic material, which comprises 0.5 to 3.0 mass% of Co, 0.1 to 1.0 mass% of Si, and a remainder made up by Cu and unavoidable impurities, wherein the average crystal particle diameter at the thicknesswise center part of the sheet is 20 µm or less and crystal particles that are in contact with the surface of the sheet and have a longer diameter of 45 µm or less exist at a density of 5 particles or less per mm of the length of the sheet in the rolling direction.