PURPOSE: An LED chip junction failure detecting apparatus is provided to determine whether a junction position which is wire-bonded is faulty or not while maintaining the failure detecting condition of an LED package array plate in the high temperature. CONSTITUTION: LED chips are installed in an LED package array plate. A lead of the LED chip package is arranged in the LED package array plate. A probe pin unit(3) is connected to the lead and sanctions electricity. A settlement plate(2) is applied a power source and is heated. The settlement plate heats the LED package array plate. The LED package array plate is settled in the settlement plate. A probe pin of the probe pin unit passes through a guiding hole(4).
