| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of processing a wafer in which a reinforcement plate is easily peeled from a top surface of the wafer. <P>SOLUTION: The method of processing the wafer having devices in respective regions sectioned by a plurality of predetermined division lines formed on a surface in a lattice shape includes a reinforcement plate arrangement process of opposing the top surface of the wafer to a support surface of the reinforcement plate having a plurality of grooves, reaching an outer periphery, formed on a support surface and arranging the reinforcement plate on the wafer via a heat-resistant bond agent; a reverse surface griding process for the wafer having the reinforcement plate held by a chuck table; a through electrode formation process of forming a through electrode connected to electrodes of the devices formed on the top surface of the wafer from the reverse surface of the wafer arranged on the reinforcement plate; a heat-resistant bond agent dissolution process of supplying a solvent for dissolving the heat-resistant bond agent from grooves exposed on an outer periphery of the reinforcement plate and making it permeate the division grooves to dissolve the heat-resistant bond agent; and a reinforcement plate removal process of removing the reinforcement plate from the top surface of the wafer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
