| 摘要 |
Disclosed is a module substrate, wherein a cavity containing an electronic component is filled with a resin, and the electronic component is encapsulated with the resin. The electronic component (20) is mounted on one main surface of a small substrate (17). A cavity (16), i.e., a through hole, is formed in a core substrate (11), and the electronic component (20) is contained in the cavity (16) by mounting the small substrate (17) on a surface electrode (13) at the periphery of the cavity (16) with a solder (14) therebetween. Resin layers (21) are formed on both the main surfaces of the core substrate (11), the inside of the cavity (16) is filled with the resin by having the resin flow into the cavity through a space between the core substrate (11) and the small substrate (17), and the electronic component (20) is encapsulated with the resin. |
